Cleaning Challenges and Solutions for Advanced Technology Nodes

摘要

Trends in further scaled CMOS technologies are reviewed with respect to the implications for cleaning and wet processing. Particularly the FEOL processes are being considered such as selective cap removal, pre-epi cleaning and post I/I photo resist removal. For technologies beyond the 15nm, several aspects of wet processing of potential new materials, such as Ge and III-V, and advanced integration schemes are covered.