首页>
外国专利>
Failure analysis method with improved detection accuracy for advanced technology node
Failure analysis method with improved detection accuracy for advanced technology node
展开▼
机译:具有改进的高级技术节点检测精度的故障分析方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method includes: determining a defective area in a semiconductor device of a semiconductor wafer; thinning the semiconductor wafer from a backside of the semiconductor wafer; bonding a first substrate to the backside of the semiconductor wafer, wherein the first substrate includes an opening and the defective area is exposed through the opening; and performing a test on the defective area by projecting a light beam from the backside through the opening.
展开▼