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Processing and Characterization of GaSb/High-k Dielectric Interfaces

机译:加工和表征气体/高k电介质界面

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The GaSb surface was exposed to various HCl-based chemical treatments in order to prepare it for high-k dielectric integration. The chemical and structural analysis was performed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The chemical analysis indicates the HCl effectively removes native oxide from GaSb surface and leaves it slightly antimony rich. The structural study reveals that the surface roughness increases upon the reexposure to air after the HCl-based surface treatment. Additional information was obtained from photo-conductance decay (PCD) measurements as well as C-V measurements of metal-Al_2O_3-GaSb capacitors.
机译:将气体表面暴露于各种基于HCl的化学处理,以便为高k介电整合制备。通过X射线光电子能谱(XPS)和原子力显微镜(AFM)进行化学和结构分析。化学分析表明HCl有效地从气体表面去除天然氧化物,并将其含有微小的锑。结构研究表明,在基于HCl的表面处理之后,表面粗糙度在重新曝光到空气时增加。从光电衰减(PCD)测量以及金属-AL_2O_3-GASB电容器的C-V测量获得附加信息。

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