Resolving thermal resistance problem of Analog device in conjunction with the ONxx Shrink Die Technology

摘要

This paper will discuss the in-depth details and experiments done to address the thermal resistance of Analog device thus paving the release and qualification of ONxx Shrink Die Technology hitting corporate drive of sure cost saving projects and bringing ON Semiconductor Philippines Incorporated to desire level of competitiveness. A closer look on the variables that contribute to these phenomena will single out on the materials that had direct impact on the problems. By introducing new bill of material from the current practice, thermal resistance problem were address enhancing convection process of integrated circuits built moreover this convective resistance parameters to include temperature drop across layers, thermal conductivity and fluidity of the epoxy, validate the desired action needed to resolve this qualification.