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Effect of resist polymer molecular weighton EUV lithography

机译:抗蚀剂聚合物分子量EUV光刻的影响

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EUV lithography performances of resist materials with different molecular weight of polymer were investigated. EUVexposure experiment using a SFET at Selete clearly showed that line-width roughness (LWR) and 1:1 half-pitch (hp)resolution were each improved using the polymers with middle and low molecular weights. These polymers showed highdissolution contrast relative to polymer with high molecular weight. Mask linearity data also showed that the polymerwith low molecular weight gave a linear dependence on critical dimension (CD) against mask size down to hp 26 nm.Thermal analysis of resist film revealed that thermal glass transition temperature (Tg) was dramatically decreased from190 °C to 110 °C with decreasing molecular weight from high to low. In contrast with Tg which directly reflectsmobility of polymer, exposure latitude (EL) was increased from 12.3 % to 14.5 % at hp 32 nm by decreasing molecularweight of polymer. Similarly, iso-dense bias was also improved by utilizing the low molecular weight polymer.Combination of PAG-B with the low molecular weight polymer caused further improvement in mask linearity, EL, andiso-dense bias at hp 32 nm, although LWR was rather increased.
机译:研究了研究具有不同分子量的聚合物的抗蚀剂材料的EUV光刻性能。在Selete上使用SFET的Euvexposure实验清楚地表明,使用中间和低分子量的聚合物改善了线宽粗糙度(LWR)和1:1半间距(HP)分辨率。这些聚合物显示出相对于具有高分子量的聚合物的高分溶解对比。掩模线性数据还表明,低分子量的聚合物对掩模尺寸(CD)对掩模尺寸下降至HP 26 NM的线性依赖性。抗蚀剂膜的热分析显示,热玻璃化转变温度(TG)从190℃显着降低。到110℃,分子量从高到低电平降低。与直接反射聚合物的TG相反,通过降低聚合物的分子量,暴露纬度(EL)在HP 32nm下从HP 32nm的12.3%增加到14.5%。类似地,通过利用低分子量聚合物,通过低分子量聚合物的PAG-B的低分子量聚合物也改善了异致偏压引起的掩盖线性,EL,Andiso-致密偏压在HP 32 NM中的进一步改善,尽管LWR相当增加。

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