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Resist underlayer film forming composition for EUV lithography having a condensation polymer

机译:具有缩聚物的用于EUV光刻的抗蚀剂下层膜形成用组合物

摘要

There is provided a resist underlayer film composition for EUV lithography that is used in a device production process using EUV lithography, reduces adverse effects of EUV, and is effective for obtaining a good resist pattern, and to a method for forming a resist pattern that uses the resist underlayer film composition for EUV lithography. A resist underlayer film-forming composition for EUV lithography, including: a polymer having a repeating unit structure of formula (1): [where each of A1, A2, A3, A4, A5, and A6 is a hydrogen atom, a methyl group, or an ethyl group; X1 is formula (2), formula (3), formula (4), or formula (0): Q is formula (5) or formula (6): and a solvent. A resist underlayer film-forming composition for EUV lithography, comprising: the polymer having the repeating unit structure of formula (1); a crosslinkable compound; and a solvent.
机译:提供了用于EUV光刻的抗蚀剂下层膜组合物,其用于使用EUV光刻的器件生产过程中,减少了EUV的不利影响,并且对于获得良好的抗蚀剂图案有效,并且提供了一种用于形成EUV光刻胶的方法。用于EUV光刻的抗蚀剂下层膜组合物。用于EUV光刻的抗蚀剂下层膜形成用组合物,其包括:具有式(1)的重复单元结构的聚合物:[其中A1,A2,A3,A4,A5和A6各自为氢原子,甲基或乙基; X 1为式(2),式(3),式(4)或式(0):Q为式(5)或式(6):和溶剂。用于EUV光刻的抗蚀剂下层膜形成用组合物,其包括:具有式(1)的重复单元结构的聚合物;和可交联化合物;和溶剂。

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