A novel packaging cum interfacing technique for microfluidic devices is reported. Unlike the conventional approach towards packaging in which the MEMS is first developed and finally packaged, a reverse approach is shown here that integrates the package with the MEMS either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated. The tubular-substrate directly translates into a package and an interface, leading to `plug-n-play' devices. Maintaining the total size of the MEMS device within the circumference of the glass tube enables this MEMS-on-tube assembly to be encapsulated within standard Swagelok?? connectors.
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