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Micromachined Bulk Wave Acoustic Bandgap Devices

机译:微机械散装波声学带隙器件

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摘要

A MEMS bulk wave acoustic bandgap has been designed and experimentally verified. The acoustic bandgaps are realized by including tungsten (W) scatterers in a SiO2 matrix. Wide frequency ranges where acoustic waves are forbidden to exist are formed due to the large density and acoustic impedance mismatch between W and SiO2. The acoustic bandgap structures are fabricated in a 7-mask process that features integrated aluminum nitride piezoelectric couplers. Acoustic bandgaps in a square lattice have been measured at 33 and 67 MHz with up to 35 dB of acoustic rejection and bandwidths exceeding 35% of the midgap.
机译:设计和实验验证了MEMS散装波声学带隙。通过在SiO 2基质中包括钨(W)散射体来实现声学带隙。由于W和SiO 2之间的大密度和声阻抗不匹配,形成了禁止存在声波的宽频率范围。声学带隙结构在具有集成氮化铝压电耦合器的7掩模工艺中制造。在33和67MHz中测量了方形晶格中的声学带隙,最高可达35 dB的声抑制和带宽超过35%的中间图。

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