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IN SITU AND REAL TIME STUDIES OF WET CHEMICAL SILICON SURFACE CLEANING REACTIONS

机译:原位和实时研究湿化学硅表面清洁反应

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In this paper electrochemical Open Circuit Potential (OCP) measurements for in-situ characterisation of wet silicon surface cleaning processes is discussed. This technique provides unique information about the evolution of semiconductor surface reactions in wet chemical environments and allows to study the kinetics of oxidation and etching processes in real time. Very good agreement between results obtained by this technique and results from MIR-FTIR (Multiple Internal Reflection -Fourier Transform Infrared Spectroscopy), XPS (Photoelectron Spectroscopy), Spectroscopic Ellipsometry (SE) and contact angle studies were found and are presented in this paper.
机译:在本文中,讨论了用于原位表征湿硅表面清洁过程的电化学开路电位(OCP)测量。该技术提供了有关湿化学环境中半导体表面反应的演变的独特信息,并允许实时研究氧化和蚀刻工艺的动力学。通过该技术获得的结果和MiR-FTIR(多个内反射 - 次 - 换红外光谱),XPS(光电子光谱),光谱椭圆形(SE)和接触角研究的结果之间非常好的一致性的达成良好的一致性。

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