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Growth of Silicon Nitride on Silicon by Electron Cyclotron Resonance Plasma Nitridation

机译:电子回旋谐振等离子体氮化硅氮化硅生长

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In this work we report the formation of silicon nitride films on silicon substrates by N2 Electron Cyclotron Resonance plasma nitridation. An absorption band located around 860-890 cm-1 was observed in the infrared spectra, which is slightly above the wave number of the characteristic silicon nitride band. According to ellipsometry measurements performed at ??= 532 nm, the thickness of the films ranged from 1.2 nm to 3.6 nm for nitridation times between 0.5 min. and 60 min. An empirical exponential law for the thickness as a function of nitridation time was found. The obtained refractive index values were higher than the expected for stoichiometric silicon nitride, which indicates that the films may be slightly silicon rich. Cross section Transmission Electron Microscopy showed the formation of a thin layer on top of the silicon with thickness consistent with the values obtained by ellipsometry. Energy Dispersive X-ray analysis confirmed the presence of N in this layer.
机译:在这项工作中,通过N 2 电子回旋谐振等离子体氮化报告在硅基材上形成氮化硅膜的形成。在红外光谱中观察到位于860-890cm -1 / sup>的吸收带,其略高于特征氮化硅带的波数。根据在α= 532nm的椭圆测量测量的情况下,膜的厚度范围为1.2nm至3.6nm,用于氮化时间0.5分钟。和60分钟。发现了作为氮化时间函数的厚度的经验指数律。所获得的折射率值高于化学计量氮化硅的预期,这表明薄膜可以略微硅。横截面透射电子显微镜显示在硅顶部形成薄层,厚度与椭圆形测量法所获得的值一致。能量分散X射线分析证实了该层中的n存在。

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