Power Semiconductor Modules play a key role in Power Electronic Systems. Their inherent advantage of integrating different power chips, circuits and sense, drive and protection functions into one sub-system with electrically insulated cooling has lead to a wide range of products, being different in size, power and function. This paper will provide an overview of today's power modules and packaging and interconnect technologies. Trends towards next generations of power modules will be highlighted. In the growing market of hybrid and electrical vehicles, products are emerging where power modules are "un-packaged" to arrive at highly integrated, compact sub-systems which are better suited for the harsh environmental conditions and the required power density than the classical power modules.
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