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Cuprous oxide films prepared by using a microwave atmospheric pressure plasma torch

机译:通过使用微波大气压等离子体火炬制备的氧化铜膜

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A 2.45 GHz microwave atmospheric pressure torch is employed to prepare cuprous oxide films. The sputtered copper films are firstly deposited on slide glass. After that, the films are annealed in air at 500°C for 12h, which would directly oxidize into cupric oxide. The annealed films are then treated by atmospheric nitrogen plasma at 800 W for 10 min. The color changed significantly from black to reddish brown after nitrogen plasma treatment. The X-ray diffraction patterns show that annealed films are cupric oxide which is vanished after plasma treatment. The cuprous oxide films appeared after nitrogen plasma treatment. The resistivity of annealed films is 16.7Ω-cm, which reduce to 2.08Ω-cm after plasma treatment. The optical band gap of annealed films, cupric oxide phase, is 2.1 eV but the value shifts toward 2.4 eV after plasma treatment. The novel microwave plasma torch posses a fast and easy way to fabricate cuprous oxide films.
机译:使用2.45GHz微波大气压炬制备亚氧化亚铜膜。溅射铜膜首先沉积在滑动玻璃上。之后,薄膜在500℃下在空气中退火12h,这将直接氧化成氧化铜。然后通过大气氮血浆在800W下处理退火的薄膜10分钟。在氮等离子体处理后,颜色从黑色到红褐色变化显着变化。 X射线衍射图案表明,退火薄膜是血浆处理后消失的氧化铜。氮等离子体处理后出现氧化铜膜。退火薄膜的电阻率为16.7Ω-cm,等离子体处理后减少到2.08Ω-cm。退火薄膜的光带隙,氧化铜阶段,是2.1eV,但在等离子体处理后,该值朝向2.4eV转移。新型微波等离子体火炬占有于制造氧化亚铜薄膜的快速简便的方法。

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