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Characterization Of Cuprous Oxide Films Prepared By Post-annealing Of Cupric Oxide Using An Atmospheric Nitrogen Pressure Plasma Torch

机译:大气压氮气压力等离子体炬对氧化亚铜进行后退火制备的氧化亚铜膜的表征

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Cuprous oxide films were prepared by the post-annealing of cupric oxide using an atmospheric pressure microwave plasma torch. Metallic copper films were deposited on glass substrate by magnetron sputtering. Then the films were annealed in air at 500 ℃ for 12 h, and the formation of cupric oxide observed. The annealed films were further treated by nitrogen plasma at a power of 800 W for 10 and 20 min. The color of the film clearly changed from black to reddish brown over 10 min. X-ray diffraction patterns show that the annealed films were cupric oxide and included cuprous oxide diffraction peaks observed aftert 10 min in nitrogen plasma. The resistivity of annealed films was 16.7 Ω cm, and was reduced markedly to about one order of magnitude under nitrogen plasma. Annealing in air and nitrogen plasma treating shifted the optical band gap from 2.1 eV to 2.4 eV. The relationship between the microstructure and plasma content of the films and their properties is investigated.
机译:通过使用大气压微波等离子体炬对氧化铜进行后退火来制备氧化亚铜膜。通过磁控溅射在玻璃基板上沉积金属铜膜。然后在空气中于500℃退火12 h,观察到氧化铜的形成。将退火过的膜用氮等离子体在800 W的功率下进一步处理10和20分钟。薄膜的颜色在10分钟内明显从黑色变为红棕色。 X射线衍射图表明,退火的膜是氧化铜,并包括在氮等离子体中10分钟后观察到的氧化亚铜衍射峰。退火膜的电阻率为16.7Ωcm,在氮等离子体下明显降低到一个数量级。空气和氮气等离子体处理中的退火将光带隙从2.1 eV移至2.4 eV。研究了薄膜的微观结构和等离子体含量与其性能之间的关系。

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