Zn-Sn and Zn-In High Temperature Lead-Free Solders

摘要

The potential of newly-designed Zn-Sn and Zn-In alloys as high temperature lead-free solders was evaluated, with particular focus on the fundamental properties and interface stability. When the Sn content of Zn-Sn ally is less than 30 mass%, the liquid fraction at 260°C is below 25 vol%, at which solid can maintain its shape. Zn-based alloys are quite ductile compared with Bi-Ag alloys. Zn-Sn alloys can maintain interconnection between a Si die and a substrate at multiple reflow treatment for Sn-Ag-Cu. Zn-Sn possesses a great potential as lead-free high temperature solder alternatives.