Wafer Scale Assembly and Test for the Production of Opto-Electronic Components

摘要

The trend of rising performance in combination with the reduction of size is still valid in the opto-electronic technology. That implies not only higher integration of functions into the chip but also a miniaturization of the hybrid assembly. It is presented a micro-assembly production line which uses a wafer as basis for the assembly process with mum accuracy. This technology is well suited for volume production since several thousand micro-systems are processed and tested on one wafer