Wafer-level CSP, wafer-level assembly/test: Integrating backend processes

摘要

A new technique using contacts applied by a wire bonder enables a wafer-level assembly and test approach throughout the entire final manufacturing process. This allows the traditional semiconductor backend to take full advantage of the economies of wafer processing found in the frontend. A key part of this is the resilient contact that can serve as both the test interface and the interconnection for first-level assembly.