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Determination of Lumped Element Package Model for Radio Frequency Surface Acoustic Wave Device Using Neural Network Techniques

机译:使用神经网络技术测定射频表面声波装置的集体元件封装模型

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Electronic packaging has a significant influence on RF surface acoustic wave (SAW) device. Hence, how to incorporate packaging effects into SAW simulation is an important issue. In this paper, neural network was employed to determine the lumped element models of bonding pads. As an example, an RF SAW filter used in GPS system was examined. The result showed a good agreement with that obtained from full wave EM simulator.
机译:电子包装对RF表面声波(锯)装置具有显着影响。因此,如何将包装效果纳入SAW模拟是一个重要问题。在本文中,采用神经网络来确定粘合垫的集成元件模型。例如,检查了GPS系统中使用的RF SAW滤波器。结果表明,与全波EM模拟器获得的良好一致。

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