In a typical Radio Frequency Identification system, the tag-reader communication is the most important characteristic of success or failure. In this system, the tag represents the weakest link in the equation and must be selected with great care. It is also important to recognize that a passive RFID tag derives its power from the RF energy generated by the reader. In turn, it communicates to the reader by modulation of the incident RF energy to create a backscatter signal, where any power loss between the antenna and the integrated circuit chip limits the maximum distance from which the tag can be read. Because the typical assembly flow of the RFID labels requires multiple steps, different assembly methodologies are being used to lower the final cost of the RFID label. Packaged parasitic components can significantly degrade the performance of the RFID tags. Today, the most insidious problem is the loss of energy due to the mismatch between the antenna and the IC chip. The final cost and fabrication requirements for the RFID tag impose a set of criteria on the assembly of the tag, where the typical methods for extracting and characterizing parasitic components of the packaging are not feasible. This research develops the theoretical mechanism for measuring and modeling the packaging parasitic components of the passive Ultra High Frequency RFID tags. The research is based on proven antenna theory and antenna measurement methods, which in turn will provide a benchmark for the current and future assembly methods for manufacturing of the RFID labels.
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