SURFACE ACOUSTIC WAVE ELEMENT CHIP, PACKAGE FOR SURFACE ACOUSTIC WAVE DEVICE, AND METHOD OF MANUFACTURING THE SURFACE ACOUSTIC WAVE DEVICE AND THE SURFACE ACOUSTIC WAVE ELEMENT CHIP

摘要

PROBLEM TO BE SOLVED: To provide a SAW device that can be downsized and used for high frequency applications.;SOLUTION: A guiding electrode 16 conducted to an IDT electrode 14 of a SAW chip 10 is formed on a side face of the SAW chip 10, an inner electrode 36 electrically connected to an external electrode 34 of a package 30 is formed on a bottom face of a cavity 38, the SAW chip 10 is mounted inside of the cavity 38 of the package 30 through a conductive adhesive 28, and the guide electrode 16 and the inner electrode 36 are configured to be made electrically connected.;COPYRIGHT: (C)2003,JPO