首页> 外文会议>Adhesion Society, Inc. Annual Meeting >Measuring the Mode I Adhesive Fracture Energy, G_(IC), of Adhesively-Bonded Composite Joints at Elevated Test Rates
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Measuring the Mode I Adhesive Fracture Energy, G_(IC), of Adhesively-Bonded Composite Joints at Elevated Test Rates

机译:在升高的测试速率下测量粘接复合接头的粘合剂骨折能量G_(IC)的粘接性裂缝能量

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Load measurements can be severely influenced by dynamic effects and become unreliable at high rates. Hence, the use of load-independent analysis methods can offer significant advantages over those requiring load values to be known. However, in these alternative schemes, the accuracy of load-line displacement and crack length measurements become highly important for the accurate determination of G_(IC) values. These parameters can be measured accurately by capturing the fracture event using high rate video imaging. The adhesive fracture energy decreased with increasing test rate and also the mode of fracture changed from stable to unstable (stick-slip type) crack propagation. Substrate thickness effects were insignificant at test rates of up to 0. 1m/s but became considerable at higher rates.
机译:负载测量可能会受到动态效果严重影响,并且在高速度下变得不可靠。因此,使用负载无关的分析方法可以提供与需要称重值的人提供显着的优势。然而,在这些替代方案中,负载线位移和裂缝长度测量的准确性对于准确确定G_(IC)值非常重要。可以通过使用高速速率视频成像捕获裂缝事件来准确地测量这些参数。粘合剂断裂能量随着试验速率的增加而降低,并且裂缝模式从稳定地变为不稳定(粘滑型)裂纹繁殖。基质厚度效应在测试速率下的测试速率高达0.1℃,但在较高的速率下变得相当大。

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