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POST METALLIZATION ANNEAL EFFECTS IN HfO_2 BASED CAPACITORS WITH VARIOUS GATE ELECTROIDES

机译:在基于HFO_2的电容器中的金属化退火效应,各种栅极电源

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Metal-oxide-semiconductor (MOS) capacitors based on HfO_2 gate stacks with various metal and metallic compound gates are compared to study the impact of the gate electrode materials. We find the oxide charge in these capacitors is mainly located at the interface between the HfO_2 layer and the interfacial layer. The capacitor with nickel silicides gate exhibits highest oxide charge density due to interfacial reactions at the NiSi/high — k layer interface. In addition, a comparative analysis of the post-metallization anneal (PMA) effects on the interfaces of the MOS capacitors is presented.
机译:比较金属氧化物半导体(MOS)基于HFO_2栅极堆叠的具有各种金属和金属化合物栅极的电容器,以研究栅电极材料的影响。我们发现这些电容器中的氧化物电荷主要位于HFO_2层和界面层之间的界面处。由于NISI /高K层界面处的界面反应,具有镍硅化物栅极的电容器具有最大的氧化物电荷密度。此外,还提出了对MOS电容器接口的金属化退火(PMA)效应的比较分析。

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