Inert gas packaging and vacuum packaging are the main packaging method of photodetectors. A multi-stage thermoelectriccooler (TEC) is used to provide low temperature environment for extended wavelength InGaAs focal plane. A gas chargingdevice is established to study nitrogen and krypton gas packaging. The performance of multi-stage TEC under differentpackaging atmospheres is tested, and the temperature field distribution is simulated by finite element analysis usingFLoEFD software. The results show that in inflatable environment the cold side of TEC can achieve low temperaturebelow 220K for the extended wavelength InGaAs detector. Gas conduction heat loss and gas convection heat loss areintroduced into the inflatable packaging compared with vacuum packaging, and the relationship between temperaturedifference and input current under different packaging atmosphere is obtained. The cooling effect of TEC in krypton gaspackaging is superior to that in nitrogen packaging, and the temperature of the cold platform can reach 211K and 215Krespectively under the same input current of 4.5A. The results of FLOEFD finite element analysis are basically inagreement with the measured results, and the temperature uniformity of the focal plane is good. Because of without usingthe getter, Inert gas packaging is an economical packaging method for infrared detector.
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