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Effects of vacuum annealing and oxygen ion beam bombarding on the electrical and optical properties of ITO films deposited by E-beam evaporation

机译:真空退火和氧离子束对电子束蒸发沉积ITO膜电和光学性能的影响

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Tin doped indium oxide (ITO) transparent conductive thin films with composition of 10 wt% SnO_2 and 89.8 wt% In_2O_3 have been deposited by electron beam evaporation technique on K9 glass substrates at room temperature. The post annealing processes are done in vacuum with different annealing temperature at 100, 200, 300 and 350 ° for 1 hour, respectively. The oxygen ion energy is 800 eV; oxygen ion beam bombarding time is 10,20,30,40 and 50min, respectively. The results show that conductivity of ITO thin films are improved by increasing annealing temperature. The resistivity of the ITO thin films decrease from 5.2×10?3? ?cm at room temperature to 1.3×10?3? ?cm(350 °C). The transmittance values of all samples in the visible range have been increased. As the oxygen ion beam bombarding time increases the resistivity reduce from 5.2×10?3? ?cm to 9×10?4? ?cm, the transmittance value improve from 66% to 82% at 550nm. Finally, the vacuum annealing and oxygen ion beam bombarding are done simultaneously, at temperature of 350 °C for 1 hours, ion bombardment time for 40 min. The resistivity of obtained ITO thin film is 7×10?4? ?cm. The maximum transmittance value is above 89% in the visible wavelength region.
机译:通过在室温下通过电子束蒸发技术沉积了10wt%SnO_2和89.8wt%的组合物的掺杂氧化铟氧化物(ITO)透明导电薄膜。后退火过程分别在100,200,300和350°下真空进行,分别为100,200,300和350°完成1小时。氧离子能量为800eV;氧离子束轰击时间分别为10,20,30,40和50min。结果表明,通过增加退火温度提高ITO薄膜的电导率。 ITO薄膜的电阻率降低了5.2×10?3? ?室温下的厘米至1.3×10?3? ?CM(350°C)。可以增加可见范围中所有样本的透射率值。由于氧离子束轰击时间增加了5.2×10?3的电阻率降低? ?cm到9×10?4? ?CM,透射率值在550nm处从66%提高到82%。最后,真空退火和氧离子束轰击是同时进行的,在350℃的温度下进行1小时,离子轰击时间为40分钟。获得的ITO薄膜的电阻率为7×10?4? ?厘米。可见波长区域中的最大透射率值高于89%。

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