HIGH-DENSITY 3-D MICROSYSTEM-IN-PACKAGE TECHNOLOGY AND ITS APPLICATION FOR INTEGRATED CCD MICRO-CAMERA VISUAL INSPECTION SYSTEM

摘要

This paper describes a high-density 3-D microsystem-in-package technology and its application for an integrated CCD micro-camera visual inspection system. The CCD imaging data transmission circuit, incorporated as a 3-D packaging module in the CCD micro-camera visual inspection system, has been realized by applying high-density interconnection stacked unit modules. The CCD viewpoint changing mechanism, which enables the inspection of inner surface of tube, was realized by 2 axial electrostatic wobble motors for rotation around the light axis of the CCD micro-camera and a catadioptric lens for internal focusing mechanism. The fabricated integrated CCD micro-camera visual inspection system captures good CCD images and operates satisfactorily as a wireless micromachine for visual inspection. The technology was confirmed to be effective for incorporating many kinds of electrical devices of different sizes, the complicated electromechanical system devices, and the optical components at far higher packaging density than it is possible to attain using conventional technology.