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The Search for Near Interface Oxide Traps - First-principles Calculations on Intrinsic SiO_2 Defects

机译:搜索近邻接氧化物疏水阀 - 内在SIO_2缺陷的第一原理计算

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The density of interface traps (D_(it)) in thermally oxidized SiC is unacceptably high for MOS device fabrication. The most severe problem is posed by the extremely high concentration of slow acceptor states near the conduction band edge of 4H-SiC. These states are attributed to near interface traps originating from (probably intrinsic) defects in the oxide. Here a systematic theoretical search is presented for possible defects in the oxide with an appropriate acceptor level. Supercell calculations using a hybrid functional approach (and resulting in a correct gap) on defects in alpha-quartz exclude the oxygen vacancy and the oxygen interstitial, as possible candidates. In contrast, these calculations predict interstitial silicon to have an acceptor level in the appropriate range. The carbon interstitial in silica has an acceptor level somewhat deeper than that. Occupation of these levels give rise to significant rearrangement of the environment, leading to a more extended defect structure.
机译:对于MOS器件制造,在热氧化SiC中的界面阱(D_(IT))的密度是不可接受的。最严重的问题是在4H-SiC的导电带边缘附近的极高浓度的慢性受体状态构成。这些状态归因于源自氧化物中(可能内在)缺陷的接口陷阱。这里,在具有适当的受体水平的氧化物中呈现系统理论搜索。使用混合功能方法(并导致正确的间隙)在α-Quartz中的缺陷中的超级单元计算排除了氧气空位和氧气间隙,如可能的候选者。相比之下,这些计算预测间隙硅在适当的范围内具有受体水平。二氧化硅中的碳口间隙具有比这更深的受体水平。占领这些水平导致环境重新排列,导致更长的缺陷结构。

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