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Effect of additional Silane on in-situ H_2 etching prior to 4H-SiC homoepitaxial growth

机译:附加硅烷对4H-SiC同性记生长前的原位H_2蚀刻的影响

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We have investigated the influence of in-situ H_2 etching on the surface morphology of the 4H-SiC substrate prior to homoepitaxial growth. In this study, we varied the types of gas atmosphere during in-situ H_2 etching; namely, hydrogen (H_2) alone, hydrogen-propane (H_2+C_3H_8), and hydrogen-silane (H_2+SiH_4). We found that in-situ H_2 etching using H_2 + SiH_4 significantly improved the surface morphology of 4H-SiC substrate just after in-situ H_2 etching. By adding Si_4, formation of bunched step structure during in-situ H_2 etching could be significantly suppressed. In addition, H_2 etching using H_2 + SiH_4 was able to remove scratches by etching a thinner layer than that using H_2 alone. We also discussed the in-situ H_2 etching mechanism under the additional SiH_4 condition.
机译:我们研究了原位H_2蚀刻在同源轴胎生长之前对4H-SiC衬底的表面形态的影响。在这项研究中,我们在原位H_2蚀刻期间改变了气体气氛的类型;即,单独,氢气(H_2),氢丙烷(H_2 + C_3H_8)和氢硅烷(H_2 + SIH_4)。我们发现使用H_2 + SIH_4的原位H_2蚀刻在原位H_2蚀刻之后显着改善了4H-SIC基板的表面形态。通过添加Si_4,可以显着抑制在原位H_2蚀刻期间形成束缚的步骤结构。另外,使用H_2 + SIH_4蚀刻H_2蚀刻能够通过蚀刻较薄的层除去比单独使用H_2的刮擦。我们还在附加SIH_4条件下讨论了原位H_2蚀刻机制。

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