REDUCTION OF ORGANIC CONTAMINATION IN SEMICONDUCTOR EQUIPMENT BY CONTROLLING OF ORGANIC OUTGASSING OF PLASTIC MATERIAL

摘要

The organic contamination in semiconductor equipment was reduced by two methods. One is selection of lowest outgassing parts. And other is developing low organic contamination parts. We selected quantity of organic contaminants are lowest silicon sealant, silicon sealant and grease. And we developed a low organic contamination electric cable (LOC cable). Our development strategies of LOC cable were obtained from the study of outgassing behavior from electric cables and the behavior of adsorption on silicon wafers. By using this low-outgassing cable and selected lowest outgassing parts in semiconductor equipment, we succeeded in reducing organic contamination in the semiconductor equipment.