Logic based DRAM technology evolution through ultimate integration

摘要

DRAM technologies run in consumer applications which require high-speed graphics, high-density integration, and low power consumption to fit with our nomadic way of life. Present memory architectures are reaching the limits of high-density integration. To meet the market needs, more and more complex processes and new materials are being introduced. As a result, significant yield detractors appear which increase the wafer cost. In this paper, we detail design and technology limitations of standard DRAM architectures. Challenges to overcome are presented. We develop capacitor-less DRAM architectures based on high performance CMOS platforms that we believe could also be recognized as simple and low-cost solutions before the arrival of the often promised universal memory.