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Thermal impedance measurement of a self-heating probe

机译:自加热探头的热阻抗测量

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In case of large temperature dependencies of the properties, due to sufficient high voltages and currents the power dissipation in electric devices causes 'virtual' electrical impedances. The reason is the thermal impedance, which is determined by the inside structure and the environmental conditions. For many fields in solid-state circuit design and sensor applications, the actual value of the thermal impedance bears important information about the state of the device and its surroundings. In the paper it is shown, how the actual value of the thermal impedance can be determined directly from the continuously measured virtual electrical impedance.
机译:在该性能的大量温度依赖性的情况下,由于足够的高电压和电流,电气设备中的功率耗散导致“虚拟”电阻。原因是热阻抗,其由内部结构和环境条件决定。对于固态电路设计和传感器应用中的许多领域,热阻抗的实际值承担有关设备状态及其周围环境的重要信息。在本文中,示出了,如何直接从连续测量的虚拟电阻抗直接确定热阻抗的实际值。

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