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Research on Influence of the Cutter Rake Angle to the Surface Quality during SPDT Machining of Crystal KDP

机译:Cryst KDP SPDT加工过程中切割器耙角对表面质量影响的研究

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摘要

Influence of the cutter rake angle to the surface quality of crystal KDP is analyzed theoretically in this paper. Analysis result shows that the tension stress reaches minimum in the crystal KDP cutting region and optimal value of the surface quality is obtained as cutter rake angle is about -45 deg. Cutting experimental of different cutter rake angle is realized on the machine tool. Experimental results show that the surface roughness of the crystal KDP reach minimum (rms is 6.521nm, Ra is 5.151nm) as the cutter rake angle is about -45 deg, this experiment certifies the correctness of this theory analysis. Theory analysis and experimental results show that influence of the cutter rake angle to surface quality of the crystal KDP is very large, for ultra-precision machining of the crystal KDP, when large negative rake diamond cutter (-45 deg) is adopted, the super-smooth surface can be obtained.
机译:本文从理论上分析了切割器耙角与晶体KDP表面质量的影响。分析结果表明,张力应力在晶体KDP切割区域中达到最小值,并获得表面质量的最佳值,作为切割器耙角约为-45°。在机床上实现了不同切割耙角的切割实验。实验结果表明,随着刀具耙角约为-45°,晶体KDP达到最小(RMS为6.521nm,Ra为5.151nm)的表面粗糙度,该实验证明了该理论分析的正确性。理论分析和实验结果表明,刀具耙角与水晶KDP表面质量的影响非常大,对于晶体KDP的超精密加工,当采用大负耙金刚石切割机(-45°)时,超级可以获得-Smooth曲面。

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