首页> 外文会议>International Symposium on Microelectronics Technology and Devices >PARTICLE SIZING AND COUNTING USING A NEW LASER LIGHT SCATTERING DETECTION TECHNIQUE ON SILICON WAFER SURFACES
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PARTICLE SIZING AND COUNTING USING A NEW LASER LIGHT SCATTERING DETECTION TECHNIQUE ON SILICON WAFER SURFACES

机译:在硅晶片表面上使用新的激光散射检测技术进行粒度尺寸和计数

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In this work, it is investigated particle sizing and counting using a new geometry to detect light scattering from small particles intentionally and sparsely deposited onto silicon wafer surfaces. That new geometry consists of a rotating mirror curved as a semi-circumference with radius of 85 mm and width of 20 mm, which collects the scattered light and concentrates it on the window of a photomultiplier (PMT) detector. In addition, bare and oxidized (100) silicon surfaces were intentionally contaminated with latex microspheres with diameters of 1.1 and 5.0 p.m. As a result, the collected intensity I(
机译:在这项工作中,使用新几何来研究粒子尺寸和计数,以检测故意从小颗粒和稀疏地沉积在硅晶片表面上的光散射。 该新几何形状由旋转镜子组成,旋转镜是半周的半径,半径为85毫米,宽度为20毫米,收集散射光并将其集中在光电倍增器(PMT)检测器的窗口上。 另外,裸露和氧化(100)硅表面有意污染,直径为1.1和5.0的直径为1.1和5.0。 结果,由于采用的集合角度,所收集的强度I(

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