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Development of capillary Z-pinch discharge light source for EUV lithography

机译:EUV光刻毛细血管Z-PINCH放电光源的研制

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Extreme ultraviolet (EUV) lithography is under discussion to be the successor of the optical lithography to reduce the size of line width in semiconductor devices below 50 nm. The use of EUV radiation around 13.5 nm in comparison to the UV radiation allows to reduce the structure sizes and offers as well sufficient large depths of focus. The usable spectral band is defined by the fact that there is a consensus to use molybdenum-silicon multilayer mirrors, which show highest reflectivity around 13.5 nm [1]. For industrially realizing the EUVL, serious efforts have been made to achieve the challenges and overcome the critical issues such as high power, high efficiency, compactness, high frequency operation, stable and debris-free EUV source. The gas-filled discharge plasma sources have the competitive advantages in above-mentioned points. Therefore, the discharge produce plasma produced by capillary Z pinch, plasma focus, hollow cathode triggered pinch und so on have attracted much attention in last several years and until now the research is being progressed. Each approach has individual technical aspects that influence the efficiency and the technical chances of realization. The comparisons of these are well defined by NeiTet al [2,3]. Common to all approaches is that optimized conversion efficiency is of major importance because this minimizes the demand on driving power for required EUV power. A debris-free EUV source with collectable radiation power of about 115 W with repetition rates exceeding 7 kHz is required to achieve an economical wafer throughput. We investigated the xenon-filled capillary Z-pinch as a potential source for the EUV lithography and employed an EUV pholodiodc to detect the EUV photon output and a high-speed camera to observe the capillary plasma dynamics, respectively. A grazing incidence spectrograph will be used to examine the spectral emission form the plasma and the scaling of this EUV light source for lithography.
机译:极端紫外(EUV)光刻是讨论的,是光学光刻的继承者,以减小50nm以下半导体器件中的线宽尺寸。与UV辐射相比,使用EUV辐射约为13.5nm允许降低结构尺寸和提供的大小焦深度。可用的光谱带由使用钼 - 硅多层镜具有共识的事实来定义,其显示在13.5nm的最高反射率[1]。在工业上实现EUVL,已经进行了认真的努力来实现挑战并克服高功率,高效率,紧凑性,高频操作,稳定和无碎片的EUV源等关键问题。气体填充放电等离子体源具有上述点具有竞争优势。因此,排出通过毛细血管Z捏,等离子体焦点产生的等离子体,中空阴极触发夹紧的近几年的注意力,直到现在正在进行研究。每种方法都有各个技术方面,影响实现的效率和技术机会。这些比较由Neitet al [2,3]很好地定义。所有方法共同的是优化的转换效率是主要重要性,因为这最大限度地减少了对所需EUV电力的驱动力的需求。需要一种无碎屑的EUV源,具有约115W的可集中辐射功率,重复速率超过7kHz,以实现经济的晶片产量。我们研究了氙填充的毛细血管Z-FINCH作为EUV光刻的潜在源,并采用EUV Pholodiodc检测EUV光子输出和高速相机分别观察毛细管等离子体动力学。放牧发射光谱仪将用于检查谱排放形成等离子体的偏移和缩放的光刻光源。

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