greases; heat sinks; adhesives; delamination; contact resistance; surface topography; cooling; radiography; semiconductor devices; acoustic microscopy; computerised tomography; scanning electron microscopy; thermal resistance; resins; filled polymers; particle reinforced composites; alumina; thermal management (packaging); aluminium; thermal management electronic packaging; heat spreader; heat sink; cold plate; thermal interface; thermal adhesive; greases; interfacial materials; contact resistance; mating heat generating unit; voids; grooves; nonsmooth surface topography; heat conduction; delamination; semiconductor device; filler depleted region; resin rich region; heat dissipation; heat generating surface; heat dissipating surface; interfacial behavior; engineering interface material; assembly process parameter; enhanced system level thermal performance; high magnification radiography; computed tomography; acoustic microscopy; scanning electron microscopy; system level thermal performance; Al;
机译:热界面材料系统中界面的微米和亚微米尺度表征
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