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Sustainable development of microelectronic technology processes integration of ecodesign

机译:微电子技术流程的可持续发展生态技术的整合

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As long as basic technology development in the field of electronics is still nearly independent of environmental or sustainability-oriented application requirements, e.g. product and system design, an increase in eco-efficiency of manufacturing processes is an important aspect for a sustainable development. Like for products the environmental as well as sustainability impact will be fixed in the first stages of the development, it is the same in the design of manufacturing processes. Material choice, evaluation of process steps and estimated production volume determine not only production cost but they fix the overall environmental impacts as well. During this developing phase there are only a few certain data available in most cases. A reliable assessment is therefore nearly impossible. To find however an optimised solution, it is important to make life-cycle know how available by involving ecodesign experts in the developing teams. Only in doing so, wrong or inefficient developments can be early identified and avoided at low cost. By this meaning, successful process developments are described to show how costs and environmental impacts were reduced by cooperation of technologists and ecodesigners. Especially waferlevel bumping packaging process and production technologies for smart tags are in focus.
机译:只要电子产品领域的基本技术开发仍然与环境或可持续发展的应用要求几乎独立,例如,如此。产品和系统设计,生产过程的生态效率的增加是可持续发展的一个重要方面。与产品一样,环境和可持续性的影响将在开发的第一阶段固定,在制造过程的设计中是相同的。物质选择,处理步骤的评估和估计的产量不仅决定了生产成本,但它们也可以解决整体环境影响。在此开发阶段期间,大多数情况下只有几种数据可用。因此,几乎不可能进行可靠的评估。要找到优化的解决方案,重要的是使生命周期知道如何通过涉及发展中国家的Ecodesign专家来了解。只有这样做,可以在低成本时获得错误或效率低下的发展。通过这种含义,描述了成功的流程开发,以展示技术人员和生态公司的合作如何减少成本和环境影响。尤其是智能标签的WAFFERLEVEL撞击包装工艺和生产技术是焦点。

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