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Sustainable development of microelectronic technology processes integration of ecodesign

机译:微电子技术的可持续发展过程生态设计的整合

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As long as basic technology development in the field of electronics is still nearly independent of environmental or sustainability-oriented application requirements, e.g. product and system design, an increase in eco-efficiency of manufacturing processes is an important aspect for a sustainable development. Like for products the environmental as well as sustainability impact will be fixed in the first stages of the development, it is the same in the design of manufacturing processes. Material choice, evaluation of process steps and estimated production volume determine not only production cost but they fix the overall environmental impacts as well. During this developing phase there are only a few certain data available in most cases. A reliable assessment is therefore nearly impossible. To find however an optimised solution, it is important to make life-cycle know how available by involving ecodesign experts in the developing teams. Only in doing so, wrong or inefficient developments can be early identified and avoided at low cost. By this meaning, successful process developments are described to show how costs and environmental impacts were reduced by cooperation of technologists and ecodesigners. Especially waferlevel bumping packaging process and production technologies for smart tags are in focus.
机译:只要电子领域的基本技术开发仍几乎独立于环境或面向可持续性的应用要求,例如在产品和系统设计方面,提高制造流程的生态效率是可持续发展的重要方面。与产品一样,环境和可持续性影响将在开发的第一阶段得到解决,在制造过程的设计中也是如此。材料的选择,工艺步骤的评估以及估计的生产量不仅决定生产成本,而且还决定了总体环境影响。在此开发阶段中,大多数情况下只有少量特定数据可用。因此,几乎不可能进行可靠的评估。然而,要找到优化的解决方案,重要的是让生态设计专家参与开发团队,使生命周期知道如何使用。只有这样做,才能及早发现错误或效率低下的发展并以低成本避免。通过这种含义,描述了成功的工艺开发过程,以展示技术人员和生态设计人员的合作如何降低成本和环境影响。尤其是智能标签的晶圆级凸点包装工艺和生产技术成为焦点。

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