chip scale packaging; integrated circuit packaging; memory architecture; logic devices; integrated circuit economics; flip-chip devices; portable applications; small form-factors; stacked die packages; mobile phone; digital camera; stacked die CSP; personal digital assistants; Fujitsu Microelectronics; ChipPAC; Intel; wire bonded packages; flip chip; semiconductor makers; IC package; memory packages; flash memory; SRAM packages; logic devices; fast turn-time; low NRE costs; stacked die products; logistical issues; engineering issues; wafer thinning; bare die; die attach; wire bond; thermal dissipation;
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