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Buckle-driven delamination of thin film and the influence of the Casimir or van der Waals force interaction

机译:扭转的分层薄膜和Casimir或Van der WaaS力相互作用的影响

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Indentation test is becoming increasingly used to quantitatively assess the thin film interfacial adhesion for its simplicity and ability to mechanically probe the smallest of solids. The conventional technique is based on the analysis of a combination of linear elastic fracture mechanics (LEFM) and simplified post-buckling theory. In this paper a full post-buckling response of thin film is investigated by FEM calculation; the contributions of double-buckling to the indentation test is discussed. The results show that double-buckling needs more energy than single-buckling case thus lead to a greater value of strain energy release rate. Finally, the influences of the Casimir or van der Waals interaction on the post-buckling behavior between the thin film and substrate are considered.
机译:压痕试验越来越多地用于定量评估薄膜界面粘附,以便其简单地和机械探测最小固体的能力。传统技术基于对线性弹性断裂力学(铅值裂缝(铅值)和简化后屈曲理论的组合的分析。在本文中,通过FEM计算研究了薄膜的全屈曲响应;讨论了双屈曲与压痕测试的贡献。结果表明,双屈曲需要比单屈曲壳更多的能量导致应变能释放速率的更大值。最后,考虑了Casimir或Van der Wa的影响对薄膜和基板之间的屈曲行为的相互作用。

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