flash memories; fine-pitch technology; notebook computers; random-access storage; stacking; memory cards; memory device packaging; leadframe packages; wafer level packages; digital revolution; consumer electronics; portable electronics devices; handheld electronics devices; digital storage; memory cards; USB drive; compact flash; secured digital; memory stick; multimedia card; volatile memory; dynamic random access memory; notebook computing; gaming applications; chip scale packages; DRAM packages; motherboards; double date rate; DDR2; clock rate; leadframe TSOP type 2; fine pitch BGA; flash memory card packages; nonvolatile memory flash; SRAM packages; VFBGA CSP; 3D stacking; memory density; die stack; package stack; DRAM DIMM modules; packaging technology; computing electronics; form factor miniaturization; high-density memory devices; CSP packages; wafer level CSP;
机译:具有表面钝化和TSV的低损耗宽带封装平台,用于RF-MEMS器件的晶圆级封装
机译:存储设备包装:从引线框到TSV
机译:层叠封装嵌入式晶圆级封装的散热能力
机译:内存设备包装 - 从引线框架封装到晶圆级包
机译:微加工的HARPSS器件的基于聚合物的晶圆级封装。
机译:扇出晶圆和面板级包装作为异构集成的包装平台
机译:无焊接引线框架辅助晶圆级包装技术为电力电子设备