Electrical Modeling and Characterization of Packaging Solutions Utilizing Lead-Free Second Level Interconnects

摘要

This paper presents measured and modeled results of two novel lead-free interconnect solutions. A surface mounted Copper Column Grid Array (CuCGA) and a demountable Spring Land Grid Array (SLGA) will be characterized and compared to the standard Column Grid Array (CGA). The geometries and materials required for reliable connections often compete with the ones required for adequate electrical performance. To characterize the electrical performance differences, several IBM ASIC menu alumina packages were built, varying the physical properties of the second level interconnects for both the CuCGA and SLGA technologies. The corresponding parts were modeled and measured for loop inductance and DC resistance of the power distribution system. Excellent model to hardware correlation was achieved, and clear candidates are recommended for equivalent or better performance compared to standard CGA interconnects.