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Infrared Heat Treatment of Ti-6Al-4V with Electroplated Cu

机译:电镀Cu的Ti-6Al-4V的红外线热处理

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The objective of this study is to investigate an innovative infrared technique to enhance adhesion of electroplated Cu on Ti-6Al-4V without dichromate dipping. The ultimate goal is to develop a Cu coating process on Ti-6Al-4V without hazardous hexavalent chromium solution treatments. Copper coatings of around 50 mu m were electroplated on Ti-6Al-4V specimens at a current density of 0.03 A/cm~2 in an acidic copper solution. To improve adhesion of coatings, infrared heat treatments were performed on copper coated samples at different temperatures and durations: 860 deg C for 600 seconds and 875 deg C for 20 to 120 seconds. This was done in the attempt to replace the use of dichromate dipping before electroplating. For samples heat treated at 860 deg C, no bonding existed even after 600 s. It is believed that solid state diffusion prevailed at 860 deg C and 600 s was not sufficient for sufficient diffusion to occur. Adhesion is poor when heat treated at 875 deg C for 20 s. Excellent adhesion was observed when the heat treatment holding time was increased to 40 seconds. For 90 seconds, the surface appearance of coatings partially changed from copper to a grayish color. There was no copper left on the surface after a 120 second heat treatment. From optical microscopic observations on sample cross sections, an interlayer between copper and Ti-6Al-4V was formed when heat treated at 875 deg C for 40 s and longer. The interlayer thickness increased as the holding time increased until depletion of copper. The sheet resistivity of coated specimens was in the order of pure copper for samples heat treated at 875 deg C and less than 90 s. During the 875 deg C heat treatment, solid state diffusion of Cu in Ti-6Al-4V, formation of eutectic solutions, dissolution of copper and Ti-6Al-4V into the liquid phase and formation of intermetallic compounds occurred. The lowest eutectic temperature of 875 deg C played a key role in this innovative process of Cu coating on Ti-6Al-4V.
机译:本研究的目的是探讨一种创新的红外技术,以增强电镀Cu对Ti-6Al-4V的粘附性而无重铬酸盐浸渍。最终目标是在没有危险的六价铬溶液处理的情况下开发TI-6AL-4V的Cu涂布过程。在酸性铜溶液中的电流密度为0.03a / cm〜2的Ti-6Al-4V样品上电镀约50μm的铜涂层。为了改善涂料的粘附,在不同温度和持续时间的铜涂覆的样品上进行红外线热处理:860℃,600秒,875℃,持续20至120秒。这是为了在电镀之前替换二色晶浸出的使用。对于在860℃处理的样品热处理,即使在600秒之后也不存在粘合。据信,在860℃下占固态扩散,600秒不足以发生足够的扩散。在875℃下热处理20秒时,粘合性差。当热处理保持时间增加至40秒时,观察到优异的粘附性。持续90秒,涂层的表面外观部分地从铜改变为灰色。在120秒的热处理后,表面不会留在表面上。根据样品横截面的光学显微镜观察,当在875℃的热处理40秒和更长时间时,形成铜和Ti-6Al-4V之间的中间层。随着保持时间的增加,层间厚度增加直至铜的耗尽。涂覆的样品的薄层电阻率为纯铜的量,用于在875℃和小于90秒的时间处理的样品热处理。在875℃的热处理期间,Cu在Ti-6Al-4V中的固态扩散,形成共晶溶液,铜溶解和Ti-6Al-4V进入液相和形成金属间化合物的形成。 875℃的最低共晶温度在TI-6AL-4V上的这种创新过程中起关键作用。

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