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A pilot study for the design and analysis of segmented automated material handling systems in 300-mm semiconductor fabs

机译:300毫米半导体工厂分段自动材料处理系统设计与分析的试验研究

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With the increase in the size and weight of 300-mm wafers, the factory area must also be enlarged Due to the long-distance material flow, elimination of manual wafer handling has become necessary; hence an automated material handling system (AMHS) is required for a 300-mm semiconductor manufacturing facility. The design of an AMHS must not only be capable of meeting numerous complex material handling requirements, but also simplify control and reduce capacity loss. This study proposes the segmented dual-track bidirectional loop (SDTBL) design for an AMHS. The configuration is based on a double-loop flow path structure that is divided into non-overlapping segments, each containing a certain number of vehicles operating in a bidirectional mode. The transfer buffer is set to enable conversion between segments and to connect each independent zone. This structure eliminates congestion and blocking without requiring additional investment by operating vehicles on mutually exclusive tracks. The segmentation strategies and steps for two scenarios are developed in this study, and a simulation model is constructed to evaluate the performance of each segmented strategy.
机译:随着300毫米晶片的尺寸和重量的增加,由于长距离材料流量,工厂面积也必须放大,消除手动晶片处理已经成为必要的;因此,300mm半导体制造设备需要自动材料处理系统(AMH)。 AMH的设计不仅必须能够满足许多复杂的物料处理要求,还可以简化控制和降低容量损耗。本研究提出了用于AMHS的分段双轨双向双向环(SDTBL)设计。该配置基于分为非重叠段的双环流路径结构,每个路径都包含以双向模式操作的一定数量的车辆。传输缓冲区被设置为使能段之间的转换并连接每个独立区域。这种结构消除了拥堵和阻塞,而无需通过在互斥轨道上操作车辆的额外投资。在本研究中开发了两种情况的分割策略和步骤,构建了仿真模型以评估每个分段策略的​​性能。

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