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EVALUATION OF HYGROTHERMAL MODELS FOR MOLD GROWTH AVOIDANCE PREDICTION

机译:对模具生长预测湿热模型的评价

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摘要

The most dominant moisture-related problem in building materials is probably mold growth. It occurs as a result of relatively high moisture concentrations. Although recent research has established the causal, physical-biological relationship between moisture content, temperature, material type, and mold growth, we do not have an established set of causal relationships between certain building parameters (such as envelope characteristics) and the risk of mold growth. This indicates a need for a “performance indicator” (PI) that expresses the mold growth risk in existing buildings as the causal effect of certain building parameters. Such a performance indicator should express the relationships between mold growth occurrence and the physical descriptors of building components, HVAC systems and layout, maintenance and cleaning operation, and so forth. This paper will deal with the first stage of research that focuses on the construction of such a PI. In this stage, we will deal with the accurate prediction of mold growth based on the availability of detailed information of the physical state (I.e., temperature and moisture content) of the materials in the building over time. Based on the accurate simulation of these states, these states can be aggregated into a PI value that is meaningful to the actual risk that mold growth will indeed occur under these circumstances. A method for the latter will be presented.
机译:建筑材料中最占优势的水分相关问题可能是模具生长。它由于相对高的水分浓度而发生。虽然最近的研究已经建立了水分含量,温度,材料类型和模具生长之间的因果,物理生物关系,但我们在某些建筑参数(如包络特性)之间没有建立的因果关系集和模具的风险生长。这表明需要“性能指标”(PI),其表达现有建筑物中的模具生长风险作为某些建筑参数的因果效果。这种性能指标应表达模具生长发生与建筑部件,HVAC系统和布局,维护和清洁操作等的物理描述符之间的关系。本文将处理第一阶段的研究,重点关注这种PI的构建。在这个阶段,我们将根据建筑物中材料中材料的物理状态(即温度和水分含量)的详细信息的可用性来处理模具生长的准确预测。基于这些国家的准确模拟,这些国家可以聚集成PI值,这对模具增长确实发生的实际风险有意义。将呈现用于后者的方法。

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