Room Temperature Bonding of Solid Substrates using Thin Metal Films (Atomic Diffusion Bonding)

摘要

Room-temperature bonding using thin metal films (atomic diffusion bonding) was applied to bonding mirror-polished solid substrates: metals to ceramics and metals to metals. The technical potential and current status were reviewed. We demonstrated fabrication of a viewing port for ultra-high vacuum chambers by bonding a vacuum flange made of Al alloy with a sapphire plate. Bonding of Al alloys (such as A1050) with Fe, Cu, and stainless alloys was achieved with bonding strength greater than the creep strengths of the aluminum alloys.