Acoustic Field Analysis of a T Type Waveguide in Single Wafer Megasonic Cleaning and Its Effect on Particle Removal

摘要

T type megasonic waveguide was analyzed by finite element method (FEM), acoustic pressure measurements and particle removal efficiency for the single wafer cleaning application. Compared to conventional longitudinal waves, a transverse waves were generated in a T type waveguide. Not like longitudinal waves, transverse waves showed changes of direction and phase which increased the cleaning efficiency.