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High-speed on-chip and chip-to-chip optical interconnection

机译:高速片上和芯片到Chip-Chip光学互连

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摘要

The present and the potential performances of opto-electronic elements such as a laser diode (LD), a photo diodes (PD) and an optical waveguide for optical interconnects are described. The fabrication and the integration technologies of the opto-electronic chips are also mentioned. The topics to be highlighted include: (1) the state of the art of vertical cavity surface emitting laser diodes (VCSELs) for optical interconnects, (2) the performance analysis of the optical interconnects with integrated optical waveguides and free space optics, and (3) Opto-electronic integration technology: hybrid-integration technique [1], receiver and transmitter design for on-chip and intra-chip optical interconnects.
机译:描述了诸如激光二极管(LD),光电二极管(Pd)和用于光学互连的光波导的光电元件的潜在性能。还提到了光电芯片的制造和集成技术。要突出显示的主题包括:(1)用于光学互连的垂直腔表面发射激光二极管(VCSELS)的技术的状态,(2)与集成光波导和自由空间光学器件的光学互连的性能分析,以及( 3)光电集成技术:混合集成技术[1],接收器和芯片内光学互连的接收器和发射机设计。

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