On-chip distributed power amplifier and on-chip or in-package antenna for performing chip-to-chip and other communications

摘要

A transmitter front-end for wireless chip-to-chip communication, and potentially for other, longer range (e.g., several meters or several tens of meters) device-to-device communication, is disclosed. The transmitter front-end includes a distributed power amplifier capable of providing an output signal with sufficient power for wireless transmission by an on-chip or on-package antenna to another nearby IC chip or device located several meters or several tens of meters away. The distributed power amplifier can be fully integrated (i.e., without using external components, such as bond wire inductors) on a monolithic silicon substrate using, for example, a complementary metal oxide semiconductor (CMOS) process.