Hybrid On-Chip/In-Package Integrated Antennas for Millimeter-Wave Short-Range Communications

摘要

A hybrid on-chip/in-package integrated antenna is designed and demonstrated for the first time in a QFN (quad flat no lead)-packaged 60-GHz ultra-wide-band (UWB) low-power transceiver. The on-chip radiating element is a folded dipole antenna realized on the transceiver high-resistivity silicon chip (CMOS-SOI technology). It is coupled electromagnetically to a patch antenna embedded under the package lid. The design was performed with a full 3D EM model of the packaged transceiver. The experimental radiation patterns and gain values are in agreement with the simulations, they show an antenna gain up to 4.6–8 dBi at 60 GHz and a 3-dB beamwidth 43$^{circ} times 72^{circ}$, suitable for short-range low-power Gbps communications.