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Hermetic package for optical devices using room temperature welding technology and transparent lid, for space applications

机译:用于光学装置的密封包,使用室温焊接技术和透明盖子,适用于空间应用

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The objective of the study was to develop a hermetic package for optical devices, with a transparent lid. A novel room temperature glass welding technology was used for the construction of the packages. The design solution and technology must be robust enough for use in space flight applications. Environmental and hermeticity tests were performed to evaluate the package capability & quality. Whilst initially targeted on a specific requirement, there are several industrial sectors that require hermetic encapsulation including; space, military, biotechnology, and telecoms etc. It is common for the space industry for packages, assemblies or even space craft, to be stored before use, driving the stringent hermeticity requirements, to prevent degradation issues when ground testing, integrating or operating in a space environment. The design and technology of the glass package proved to be robust: environmental tests had no influence on the functionality or properties. Other benefits of the laser welded glass package were also discovered: hermeticity, easy failure analysis and inspection due to the lid and package transparency, and mountable design onto a PCB (printed circuit board). Welding technique offers a quick, one-step, room temperature process without any additive materials.
机译:该研究的目的是开发一种用于光学装置的密封包装,具有透明盖子。新颖的室温玻璃焊接技术用于封装的构建。设计解决方案和技术必须足够强大,以便在太空飞行应用中使用。进行环境和密封性测试以评估包装能力和质量。虽然最初针对特定要求,但有几个需要密封封装的工业部门,包括;空间,军事,生物技术和电信等。对于封装,组件或甚至空间工艺的空间行业是常见的,在使用前储存,推动严格的密封性要求,以防止地面测试,集成或操作时的降级问题空间环境。被证明的玻璃包装的设计和技术具有强大:环境测试对功能或性质没有影响。还发现了激光焊接玻璃包装的其他优点:密封性,易于故障分析和检查,由于盖子和封装透明度,可安装在PCB(印刷电路板)上。焊接技术提供快速,一步,室温工艺而没有任何添加材料。

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