Application of transient liquid phase sintering (TLPS) interconnect material for high temperature Pb-free RoHS compliant MLCC lead attachment

摘要

Transient Liquid Phase Sintering is a process that provides high temperature Pb-free RoHS compliant interconnect solutions that exceed the high temperature capabilities of Pb-Sn solders. KEMET, working in collaboration with Ormet Circuits Inc. has successfully applied Ormet's TLPS technology to a line of Leaded Multi-layer Ceramic Capacitors (MLCC) components for high temperature applications. The material is Pb-free, RoHS compliant and able to withstand process and operating temperatures > 400°C while having initial processing temperatures of less than 300°C. Potential applications for TLPS are in the automotive, aerospace, oil, gas, and geothermal exploration industries where electronics are being exposed to higher operating temperatures and require robust interconnects capable of withstanding harsh environments.