A Full-dry Processing Technique from Sacrificial Layer Etching to Water-repellent Coating

摘要

A sacrificial layer dry etching technique, which permits the microscopic structures used for microsensors to be released from silicon substrates with high repeatability, and a water-repellent dry coating technique, which prevents released structures from sticking to substrates during operation, have been developed. The usefulness of the new full-dry processing was evaluated by comparing the present dry method with conventional wet methods with respect to the lengths of releasable cantilevers. The full-dry processing from etching to coating permitted sustainable cantilevers about three times longer than under the conventional wet method to be fabricated.